| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the luminance of an optical device formed by dividing an optical device wafer. <P>SOLUTION: A dividing method of this invention includes: a depressed part formation process in which depressed parts are formed on a back surface Wb of a sapphire wafer W that a light emitting layer 412 is laminated on a surface thereof; and an optical divice wafer division process in which an optical device wafer W is divided into individual optical devices 411 along a division planned lines. Outer shape surfaces, forming various angles relative to the respective back surfaces Wb of the individual optical devices 411, are formed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
