Electronic component

摘要

The component has a semiconductor element (12), and a contact element fastened at a side of the semiconductor element. The contact element includes a flexible conductor foil (14) with a conductive path. The conductor foil has a hump (26) with essentially constant conductor foil thickness. The hump forms a local elevation with respect to conductor foil level and positioned and dimensioned in such a manner that a section of the conductive path of the conductor foil runs on the hump. The conductive path section stays in electrical contact with a contact position of the semiconductor element. An independent claim is also included for a method for producing an electronic component.