发明名称 発光装置及び照明器具
摘要 PROBLEM TO BE SOLVED: To attain downsizing of a substrate without impairing heat radiation performance.SOLUTION: A bending control part 62 for controlling bending of a substrate 2 is provided in a panel 6 at a position opposed to a projected part 20 of the substrate 2. As a result, even if the substrate 2 is bent by heat emitted from an LED 1, it hits the bending control part 62 to control bending (warping) of the substrate 2. Accordingly, since the substrate 2 is screwed at two parts of both ends in longitudinal direction and bending of the substrate 2 is controlled by the bending control part 62, compared with a conventional example as written in a patent document 1 wherein the substrate is fixed by four screws, downsizing of the substrate 2 can be attained without impairing heat radiation performance.
申请公布号 JP5887552(B2) 申请公布日期 2016.03.16
申请号 JP20120042766 申请日期 2012.02.29
申请人 パナソニックIPマネジメント株式会社 发明人 北川 拓也;福田 篤史;松本 弘之;由田 宏史
分类号 F21K9/00;F21S2/00;F21V19/00;H01L33/48 主分类号 F21K9/00
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