Package assembly and methods for forming the same

摘要

A device includes a first package component, and a second package component underlying the first package component. The second package component includes a first electrical connector at a top surface of the second package component, wherein the first electrical connector is bonded to the first package component. The second package component further includes a second electrical connector at the top surface of the second package component, wherein no package component is overlying and bonded to the second electrical connector.

主权项

1. A system comprising:
a first package component; a second package component, wherein each of the first and the second package components comprises:
a first electrical connector and a second electrical connector, wherein a first relative position of the first electrical connector in the first package component is identical to a second relative position of the first electrical connector in the second package component, and a third relative position of the second electrical connector in the first package component is identical to a fourth relative position of the second electrical connector in the second package component; a first surface dielectric layer over the first package component, wherein the first electrical connector of the first package component is exposed through an opening in the first surface dielectric layer, and the second electrical connector of the first package component is covered by the first surface dielectric layer; and a second surface dielectric layer over the second package component, wherein the first surface dielectric layer and the second surface dielectric layer are formed of a same dielectric material, and both the first electrical connector and the second electrical connector of the second package component are exposed through the second surface dielectric layer.