Apparatus for package reinforcement using molding underfill

摘要

A method and apparatus for a reinforced package are provided. A package component may be electrically coupled to a device through a plurality of electrical connections. A molding underfill may be interposed between the package component and the device and may encapsulate the plurality of electrical connections or a subset of the plurality of electrical connections between the package component and the device. The package component may also include a molding compound. The plurality of the electrical connections may extend through the molding compound with the molding underfill interposed between the molding compound and the device to encapsulate the plurality of electrical connections or a subset of the plurality of electrical connections between the package component and the device. The molding underfill may extend up one or more sides of the package component.

主权项

1. An apparatus comprising:
a package component, the package component having a first side and a second side; a plurality of electrical connections on the second side of the package component; a device electrically coupled to the plurality of electrical connections; a molding compound on the second side of the package component, the molding compound having a first height, wherein the plurality of electrical connections extend through the molding compound; and a molding underfill between the molding compound and the device, wherein the molding underfill encapsulates a subset of the plurality of electrical connections without encapsulating all of the plurality of the electrical connections.