Three-dimensional structures and related methods of forming three-dimensional structures

摘要

The present disclosure provides three-dimensional structures and related methods. The three-dimensional structures may define patterns of positive and negative spaces on opposing surfaces that combine to form the three-dimensional structures. The negative spaces of the patterns may intersect to form apertures through the three-dimensional structures, which may define linear or non-linear paths therethrough. The apertures may be configured to provide desirable characteristics with respect to light, sound, and fluid travel therethrough. Further, the three-dimensional structures may be configured to define desired stiffness, weight, and/or flexibility. The three-dimensional structures may be employed in embodiments including heat sinks, housings, speaker or vent covers, springs, etc.

主权项

1. A three-dimensional structure for a housing of an electronic device, the three-dimensional structure comprising:
a unitary body comprising: a first surface comprising a first pattern of a positive space defined by a first non-random pattern of a negative space that extends into the body a first defined depth in accordance with a first axis, and a second surface at a different position on the body from the first surface and comprising a second pattern of a positive space defined by a second non-random pattern of a negative space that extends into the body a second depth and in accordance with a second axis, wherein at least some of the first non-random pattern of negative space and the second non-random pattern of negative space overlap with each other forming apertures that extend through the unitary body having a size and a shape in accordance with an amount of overlap, wherein the first and second positive spaces combine to form a positive surface of the three dimensional structure.