发明名称 発光装置及び発光装置用成形体の製造方法
摘要 Disclosed is a light-emitting device comprising a light-emitting element (10) composed of a gallium nitride compound semiconductor having an emission peak wavelength of not less than 430 nm; a molded body (40) provided with a recessed portion having a bottom surface on which the light-emitting element (10) is mounted and a lateral surface; and a sealing member (50) containing an epoxy resin including a triazine derivative epoxy resin, or a silicon-containing resin. The molded body (40) is obtained by using a cured product of a thermosetting epoxy resin composition essentially containing an epoxy resin including a triazine derivative epoxy resin, and has a reflectance of not less than 70% at the wavelengths of not less than 430 nm.
申请公布号 JP5885724(B2) 申请公布日期 2016.03.15
申请号 JP20130221031 申请日期 2013.10.24
申请人 日亜化学工業株式会社 发明人 蔵本 雅史;三木 倫英;月岡 智也;岸本 智久
分类号 H01L33/60;H01L33/56 主分类号 H01L33/60
代理机构 代理人
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