发明名称 プラズマ処理方法
摘要 A plasma etching method performs plasma etching on a sample, which has laminated films containing a variable layer of a magnetic film, a barrier layer of an insulating material, and a fixed layer of a magnetic film, using a hard mask, which includes at least one of a Ta film and a TiN film. The plasma etching method includes a first step of etching the laminated films using N2 gas; and a second step of etching the laminated films after the first step using mixed gas of N2 gas and gas containing carbon elements.
申请公布号 JP5883772(B2) 申请公布日期 2016.03.15
申请号 JP20120258087 申请日期 2012.11.27
申请人 株式会社日立ハイテクノロジーズ 发明人 吉田 篤;山本 直広;須山 淳;山田 健太郎;藤田 大介
分类号 H01L21/3065;H01L21/8246;H01L27/105;H01L43/08;H01L43/12 主分类号 H01L21/3065
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