| 摘要 |
PROBLEM TO BE SOLVED: To provide an ultrasonic bonding device capable of suppressing peel-off of a metal plate.SOLUTION: An ultrasonic bonding device 10 bonding between a conductor and a band-like metal plate with a bent neck part by pressing a flat part of the metal plate and adding ultrasonic vibration, comprises: a first projection 23 formed on a pressing part for pressing the flat part of the metal plate, and cutting into the metal plate at the pressing of the flat part of the metal plate; and a second projection 14 formed on the pressing part, cutting into the metal plate at the pressing of the flat part of the metal plate, and having a height higher than the first projection 23. The first projection 23 and the second projection 14 are arranged in a plurality of rows in the pressing part, and the first projection 23 is arranged at least in the first row of the plurality of rows and cuts into the neck part side of the flat part at the pressing of the flat part of the metal plate. |
