Auto-sequencing multi-directional inline processing method

摘要

A method for auto-sequencing of plasma processing system for concurrent processing of several substrates. The method autonomously sequence processing and move substrates in different directions as necessary. The method moves two substrate trays together into the processing chamber for substrate exchange, and remove the trays from the chamber one at a time. When needed, the method moves one tray into the processing chamber for removal of the susceptor without exposing the chamber to atmospheric environment.

主权项

1. A method for auto-sequencing operation of a dual-load processing system having a controller, wherein the processing system comprises a vacuum processing chamber that has two loading ports on two opposing sides of the vacuum processing chamber, and two loadlock chambers, each loadlock chamber coupled to one of the two ports via a vacuum valve, comprising:
when fresh substrates are introduced into either one of the loadlock chambers, initiating vacuum pumping thereby reducing pressure at that loadlock chamber; when a desired vacuum level is achieved at either one of the loadlock chambers, sending a ready signal to the controller, indicating that loadlock chamber is ready for substrates exchange; when processing is completed in the vacuum processing chamber, causing the controller to determine which loadlock chamber has first sent the ready signal and initiating substrates exchange with the loadlock chamber that has first sent the ready signal, indicated as a first ready loadlock, wherein the initiating substrates exchange is performed by unloading processed substrates into the first ready loadlock and loading fresh substrates from the first ready loadlock chamber.