| 摘要 |
PURPOSE: A semiconductor package and a semiconductor light emitting device are provided to prevent the generation of cracks in the semiconductor package. CONSTITUTION: A semiconductor package (10) includes a port part (11), an electrode part (12), and a filling resin (13). The port part has a mounting surface (11a) for a semiconductor device (20). A port protrusion part (111) in the port part is protruded towards the electrode part. The electrode part has a contact surface (12a) electrically connected to the semiconductor device. A filling resin fixes the port part and the electrode part while the mounting surface and the contact surface are exposed to the filling resin. |
