| 摘要 |
The present technology relates to a system in package, which includes: a first semiconductor chip and a second semiconductor chip arranged in a first area on a substrate; and a controller which is arranged in a second area on the substrate, and selectively provides a power source voltage to the first semiconductor chip or the second semiconductor chip according to data output of the first and the second semiconductor chip. Each of the first and the second semiconductor chip is provided with a first power source area supplied with the power source voltage in common from the controller during an input/output operation of the data as commonly connected by a first wire; an output driver for the data output; and a second power source area which is connected to the controller independently by a second wire and a third wire, and is supplied with the power source voltage for an operation of the output driver during the data output independently. |
