Devices employing semiconductor die having hydrophobic coatings, and related cooling methods

摘要

Devices employing semiconductor die having hydrophobic coatings, and related cooling methods are disclosed. A device may include at least one semiconductor die electrically coupled to a substrate by electrical contact elements. During operation the semiconductor die and the electrical contact elements generate heat. By applying hydrophobic coatings to the semiconductor die and the electrical contact elements, a cooling fluid may be used to directly cool the semiconductor die and the electrical contact elements to maintain these components within temperature limits and free from electrical shorting and corrosion. In this manner, the semiconductor die and associated electrical contact elements may be cooled to avoid the creation of damaging localized hot spots and temperature-sensitive semiconductor performance issues.

主权项

1. An electrical assembly, comprising:
at least one semiconductor die; a substrate configured to interface with an electrical source; at least one electrical contact element conductively connecting the at least one semiconductor die to the substrate; and
a hydrophobic coating attached to the at least one semiconductor die, substrate, and at least one electrical contact element, wherein the hydrophobic coating is configured to form an effective contact angle with a water droplet of more than one-hundred fifty (150) degrees.