Method and apparatus for a seal ring structure

摘要

A wafer seal ring may be formed on a first and/or a second wafer. One or both of the first and/or second wafers may have one or more dies formed thereon. The wafer seal ring may be formed to surround the dies of a corresponding wafer. One or more die seal rings may be formed around the one or more dies. The wafer seal ring may be formed to a height that may be approximately equal to a height of one or more die seal rings formed on the first and/or second wafer. The wafer seal ring may be formed to provide for eutectic or fusion bonding processes. The first and second wafers may be bonded together to form a seal ring structure between the first and second wafers. The seal ring structure may provide a hermetic seal between the first and second wafers.

主权项

1. An apparatus comprising:
a pair of bonded wafers, at least one of the pair of bonded wafers having a plurality of dies formed thereon; a plurality of die seal rings, wherein each of the die seal rings is formed around a respective one each of the plurality of dies; and a pair of wafer seal rings between the pair of bonded wafers, the pair of wafer seal rings having a uniform width, wherein the pair of wafer seal rings surround the plurality of die seal rings; and an alignment post between the pair of bonded wafers, wherein the alignment post is located between the pair of wafer seal rings.