| 主权项 |
1. A packaged micro-electro-mechanical system (MEMS) device comprising:
a rigid substrate having a chip pad surrounded by a plurality of metal contacts; a semiconductor chip of a first height, the chip surface including a central area with a MEMS device and peripheral areas with terminals, the chip side opposite the surface attached to the substrate pad by an adhesive layer of a third height, the chip terminals wire-connected to the substrate contacts; and a package including a light-sensitive first and an opaque second polymerized compound, the second compound encapsulating the substrate, the wire connections, and the chip peripheral areas including the terminals, and further forming a sidewall around the un-encapsulated central area; and the first compound continuing from the sidewall as a frame around the un-encapsulated central area, the frame having a second height and a width. |
