发明名称 EMBEDDED TUNGSTEN RESISTOR
摘要 A high TCR tungsten resistor on a reverse biased Schottky diode. A high TCR tungsten resistor on an unsilicided polysilicon platform geometry. A high TCR tungsten resistor between two parallel polysilicon leads on remaining contact etch stop dielectric. A high TCR tungsten resistor embedded in a intermetal dielectric layer above a lower interconnect layer and below an upper interconnect layer. A method of forming a high TCR tungsten resistor on a reverse biased Schottky diode. A method of forming high TCR tungsten resistor on an unsilicided polysilicon platform geometry. A method of forming high TCR tungsten resistor between two parallel polysilicon leads on remaining contact etch stop dielectric. A method of forming high TCR tungsten resistor embedded in a inter metal dielectric layer above a lower interconnect layer and below an upper interconnect layer.
申请公布号 US2016071838(A1) 申请公布日期 2016.03.10
申请号 US201514864504 申请日期 2015.09.24
申请人 TEXAS INSTRUMENTS INCORPORATED 发明人 McMullan Russell Carlton;Pushkarakshan Binu Kamblath;Narayan Subramanian J.;Sankaran Swaminathan;Kunz Keith Edmund
分类号 H01L27/06;H01L49/02;H01L29/66 主分类号 H01L27/06
代理机构 代理人
主权项 1. A method for fabricating an integrated circuit, comprising: forming a lead with a lead length on a semiconductor wafer; forming dielectric sidewalls on the lead; depositing a dielectric layer over the lead; forming a photoresist pattern on the dielectric layer with a resistor trench opening adjacent to the lead; etching the dielectric layer through the resistor trench opening to form a resistor trench; filling the resistor trench with tungsten; and planarizing the tungsten to form a tungsten resistor having a resistor length equal to or less than the lead length of the lead.
地址 Dallas TX US