发明名称 |
EMBEDDED TUNGSTEN RESISTOR |
摘要 |
A high TCR tungsten resistor on a reverse biased Schottky diode. A high TCR tungsten resistor on an unsilicided polysilicon platform geometry. A high TCR tungsten resistor between two parallel polysilicon leads on remaining contact etch stop dielectric. A high TCR tungsten resistor embedded in a intermetal dielectric layer above a lower interconnect layer and below an upper interconnect layer. A method of forming a high TCR tungsten resistor on a reverse biased Schottky diode. A method of forming high TCR tungsten resistor on an unsilicided polysilicon platform geometry. A method of forming high TCR tungsten resistor between two parallel polysilicon leads on remaining contact etch stop dielectric. A method of forming high TCR tungsten resistor embedded in a inter metal dielectric layer above a lower interconnect layer and below an upper interconnect layer. |
申请公布号 |
US2016071838(A1) |
申请公布日期 |
2016.03.10 |
申请号 |
US201514864504 |
申请日期 |
2015.09.24 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
McMullan Russell Carlton;Pushkarakshan Binu Kamblath;Narayan Subramanian J.;Sankaran Swaminathan;Kunz Keith Edmund |
分类号 |
H01L27/06;H01L49/02;H01L29/66 |
主分类号 |
H01L27/06 |
代理机构 |
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代理人 |
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主权项 |
1. A method for fabricating an integrated circuit, comprising:
forming a lead with a lead length on a semiconductor wafer; forming dielectric sidewalls on the lead; depositing a dielectric layer over the lead; forming a photoresist pattern on the dielectric layer with a resistor trench opening adjacent to the lead; etching the dielectric layer through the resistor trench opening to form a resistor trench; filling the resistor trench with tungsten; and planarizing the tungsten to form a tungsten resistor having a resistor length equal to or less than the lead length of the lead. |
地址 |
Dallas TX US |