| 摘要 |
A component mounting device (7) is provided with: a mounting head (51) for mounting components on a substrate (900); and a transfer part (6) in which a plurality of transfer lanes (6a, 6b) transferring the substrate (900) are disposed to vertically overlap each other. The plurality of transfer lanes (6a, 6b) are configured to be changeable in width so as to enable substrates having different widths to be transferred. |
