发明名称 |
THIN FILM TRANSISTOR SUBSTRATE |
摘要 |
A thin film transistor substrate is disclosed, which comprises: a substrate; and plural thin film transistor units disposed on the substrate and respectively comprising: an active layer disposed on the substrate and made of polysilicon; an insulating layer disposed on the active layer; and a source electrode and a drain electrode disposed on the insulating layer, wherein the insulating layer comprises a first region corresponding to the active layer and a second region corresponding to a region outside the active layer, and a roughness of the first region is larger than that of the second region. |
申请公布号 |
US2016071887(A1) |
申请公布日期 |
2016.03.10 |
申请号 |
US201414541105 |
申请日期 |
2014.11.13 |
申请人 |
INNOLUX CORPORATION |
发明人 |
CHAO Kuang-Pin;CHU Hsia-Ching;SUN Ming-Chien |
分类号 |
H01L27/12 |
主分类号 |
H01L27/12 |
代理机构 |
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代理人 |
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主权项 |
1. A thin film transistor substrate, comprising:
a substrate; and plural thin film transistor units disposed on the substrate and respectively comprising:
an active layer disposed on the substrate and made of polysilicon;an insulating layer disposed on the active layer; anda source electrode and a drain electrode disposed on the insulating layer, wherein the insulating layer comprises a first region corresponding to the active layer and a second region corresponding to a region outside the active layer, and a roughness of the first region is greater than that of the second region, wherein the thin film transistor units further respectively comprise a metal layer disposed on the insulating layer and having plural first protrusions at a top surface of the metal layer, and wherein the metal layer has a first thickness, the first protrusions respectively have a first height which is a distance between a top end of the first protrusion and the top surface of the metal layer, and the first height of the first protrusion is 10% to 30% of the first thickness of the metal layer. |
地址 |
Chu-Nan TW |