Method for Increasing Adhesion of Copper to Polymeric Surfaces

摘要

Disclosed herein are methods and systems for conditioning a polymeric layer on a substrate to enable adhesion of a metal layer to the polymeric layer. Techniques may include conditioning the polymeric layer with nitrogen-containing plasma to generate a nitride layer on the surface of the polymeric layer. In another embodiment, the conditioning may include depositing a CuN layer using a lower power copper sputtering process in a nitrogen rich environment. Following the condition process, a higher power copper deposition or sputtering process may be used to deposit copper onto the polymeric layer with good adhesion properties.

主权项

1. A system comprising:
a surface energy chamber comprising:
a first tray chuck;an electrode adjacent to the first tray chuck, the electrode comprising one or more of the following: parallel plate electrode, a loop antenna, a helical antenna, or a magnetic coil; anda power source in electrical communication with the electrode, the power comprising a radio frequency (RF) source or a microwave source; a metal deposition chamber comprising:
a second tray chuck; anda metal sputtering target adjacent to the sputter tray chuck; an encapsulated device tray handling system to move a tray of encapsulated electronic devices between the surface energy chamber and the metal deposition chamber.