| 摘要 |
An optoelectronic semiconductor chip includes a semiconductor layer sequence and a carrier substrate. A first and a second electrical contact layer are arranged at least regionally between the carrier substrate and the semiconductor layer sequence and are electrically insulated from each other by an electrically insulating layer. A minor layer is arranged between the semiconductor layer sequence and the carrier substrate. The semiconductor chip comprises a transparent encapsulation layer covering side surfaces of the semiconductor layer sequence, side surfaces of the minor layer and side surfaces of the electrically insulating layer facing towards the side surfaces of the semiconductor chip. |
