HIGH-STRENGTH TITANIUM-COPPER FOIL, AND METHOD FOR PRODUCING THE SAME

摘要

Provided is a high-strength titanium-copper foil which is desirable as a conductive spring member used to electronic equipment components, such as an auto-focus camera module or the like. The high-strength titanium-copper foil comprises 2.0-4.0 mass% of Ti and the remainder consisting of Cu and inevitable impurities and has 0.2% of internal force of greater than or equal to 1200 MPa in a direction parallel with a rolling direction and in an orthogonal direction. Moreover, the high-strength titanium-copper foil has a spring limit value of 800 MPa in a direction parallel with the rolling direction and in an orthogonal direction.