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发明名称
センサーデバイス、センサーモジュール、力検出装置、ロボット
摘要
A sensor device includes a package, a sensor element that is disposed in the package, and a lid that seals the package. The lid includes a flexible portion that surrounds the vicinity of the sensor element in a plan view.
申请公布号
JP5880934(B2)
申请公布日期
2016.03.09
申请号
JP20110278968
申请日期
2011.12.20
申请人
セイコーエプソン株式会社
发明人
岡 秀明;神谷 俊幸;河合 宏紀
分类号
G01L1/16;B25J19/02;G01L5/16
主分类号
G01L1/16
代理机构
代理人
主权项
地址
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