| 发明名称 | Composite reconstituted wafer structures | ||
| 摘要 | A reconstituted electronic device comprising at least one die and at least one passive component. A functional material is incorporated in the substrate of the device to modify the electrical behavior of the passive component. The passive component may be formed in redistribution layers of the device. Composite functional materials may be used in the substrate to forms part of or all of the passive component. A metal carrier may form part of the substrate and part of the at least one passive component. | ||
| 申请公布号 | US9281354(B2) | 申请公布日期 | 2016.03.08 |
| 申请号 | US201414341178 | 申请日期 | 2014.07.25 |
| 申请人 | QUALCOMM TECHNOLOGIES INTERNATIONAL, LTD. | 发明人 | Lenive Vlad;Stacey Simon |
| 分类号 | H01L29/00;H01L49/02;H01L27/04;H01L23/64;H01L23/00;H01L23/522;H01L23/28;H01L23/485;H01L23/13;H01L23/492;H01L23/498;H01L23/538;H01L23/66 | 主分类号 | H01L29/00 |
| 代理机构 | Procopio, Cory, Hargreaves & Savitch, LLP | 代理人 | Procopio, Cory, Hargreaves & Savitch, LLP |
| 主权项 | 1. A reconstituted electronic device, comprising; a substrate in which at least one die and one piece of functional material are embedded; and at least one metallic redistribution layer on a surface of the substrate, the at least one metallic redistribution layer defining an electrical component in an area at least partially within the area of the functional material when viewed in a plan view, wherein the electrical component is an inductor in the form of an antenna, and the functional material includes a hole in which the at least one die is positioned so that the at least one die is surrounded by the functional material. | ||
| 地址 | Cambridge GB | ||