Alignment marks and alignment methods for aligning backside components to frontside components in integrated circuits

摘要

An imaging system may include an imager integrated circuit with frontside components such as imaging pixels and backside components such as color filters and microlenses. The imager integrated circuit may be mounted to a carrier wafer with alignment marks. Bonding marks on the carrier wafer and the imager integrated circuit may be used to align the carrier wafer accurately to the imager integrated circuit. The alignment marks on the carrier wafer may be read, by fabrication equipment, to align backside components of the imager integrated circuit, such as color filters and microlenses, with backside components of the imager integrated circuit, such as photodiodes.

主权项

1. A system, comprising:
a central processing unit; memory; input-output circuitry; and an imaging device, comprising:
a device substrate having a first side and a second side;a plurality of semiconductor components located on the first side of the device substrate;a carrier substrate having a first side mounted to the first side of the device substrate and having alignment marks on a second side; andat least one component on the second side of the device substrate, wherein the at least one component is formed in alignment with the semiconductor components located on the first side of the device substrate and the alignment marks on the second side of the carrier substrate.