| 摘要 |
The present invention provides an apparatus for external appearance inspection of a semiconductor device to reduce facility cost and increase work efficiency, which may comprise: a picker module, which absorbs and picks up multiple semiconductor devices that are objects of external appearance inspection to move them to a certain location, using multiple vacuum absorption nozzles spaced at equal intervals, and multiple vision camera modules, which film the semiconductor device from both lateral sides and lower part, respectively, while the picker module picks up the semiconductor device and moves it to the certain location. |
