| 发明名称 | Semiconductor package | ||
| 摘要 | A semiconductor package may include a first die and a second die disposed adjacent to the first die. The semiconductor package may include a plurality of pads configured for receiving and outputting data mask addresses. The semiconductor package may include mapping blocks configured to map data mask signals among the first die, the second die, and the plurality of pads in response to a received address. | ||
| 申请公布号 | US9281051(B2) | 申请公布日期 | 2016.03.08 |
| 申请号 | US201414517565 | 申请日期 | 2014.10.17 |
| 申请人 | SK Hynix Inc. | 发明人 | Kong Kyu Bong;Na Kwang Jin |
| 分类号 | G11C11/34;G11C11/4096;G11C7/10;G11C5/02;G11C5/06 | 主分类号 | G11C11/34 |
| 代理机构 | William Park & Associates Ltd. | 代理人 | William Park & Associates Ltd. |
| 主权项 | 1. A semiconductor package comprising: a first die; a second die disposed adjacent to the first die; a plurality of pads configured for receiving and outputting data mask addresses; and mapping blocks configured to map data mask signals among the first die, the second die, and the plurality of pads in response to a received address. | ||
| 地址 | Gyeonggi-do KR | ||