| 发明名称 |
Underfill composition and semiconductor device and manufacturing method thereof |
| 摘要 |
To provide a solid preapplication underfill material that has excellent workability, has a high degree of freedom for solder bonding processes, and enables the formation of a solder bond with high reliability. (Resolution Means) The underfill composition of the present disclosure contains a hardened epoxy resin and has a viscosity of 1000 Pa·s or more at 30° C. The hardening epoxy resin includes a crystalline epoxy resin at not less than 50 wt % relative to an entire resin composition. |
| 申请公布号 |
US9281255(B2) |
申请公布日期 |
2016.03.08 |
| 申请号 |
US201314435460 |
申请日期 |
2013.10.29 |
| 申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
Kawate Kohichiro |
| 分类号 |
H01L23/488;H01L23/29;H01L21/30;C08F2/46;H01L21/56;H01L25/00;H01L23/31;H01L23/00;H01L25/065;H01L21/78;C09K5/14;C08K3/22 |
主分类号 |
H01L23/488 |
| 代理机构 |
|
代理人 |
Bramwell Adam |
| 主权项 |
1. An underfill composition comprising:
a hardening epoxy resin comprising a crystalline epoxy resin of not less than about 50 wt % relative to an entire resin composition, wherein the hardening epoxy resin has a viscosity of about 1000 Pa·s at 30° C., wherein the crystalline epoxy resin is a biphenyl epoxy resin with a molar weight of not more than about 500; and an inorganic filler having about 100 parts by mass relative to about 100 parts by mass of the entire resin composition. |
| 地址 |
St. Paul MN US |
