APPARATUS FOR DECREASING WARPAGE

摘要

A warpage improving apparatus is provided. The warpage improving apparatus comprises: first and second guide units which define a path of a flexible printed circuit board, and are separated from each other; and a third guide unit positioned between the first and second guide units, and guiding the flexible printed circuit board. The third guide unit is protruded in a direction crossing a progress direction of the flexible printed circuit board, and applies tension to the flexible printed circuit board.