Halogen-free resin composition, and copper clad laminate and printed circuit board using same

摘要

The halogen-free resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 50 parts by weight of styrene-maleic anhydride; (C) 5 to 100 parts by weight of polyphenylene oxide resin; (D) 10 to 150 parts by weight of phosphazene; and (E) 10 to 1000 parts by weight of inorganic filler. By using specific components at specific proportions, the halogen-free resin composition offers the features of low dielectric constant, low dissipation factor, high heat resistance and high flame retardancy, and can be made into prepreg or resin film, and thereby used in copper clad laminate or printed circuit board.

主权项

1. A prepreg made from a halogen-free resin composition and a fiberglass cloth, wherein the halogen-free resin composition comprises:
(A) 100 parts by weight of cyanate ester resin; (B) 5 to 50 parts by weight of styrene-maleic anhydride (SMA); (C) 5 to 100 parts by weight of polyphenylene oxide (PPO) resin; (D) 10 to 150 parts by weight of phosphazene; and (E) 10 to 1000 parts by weight of inorganic filler, wherein a laminate made from the prepreg has heat resistance T288 measured by TMA>70 minutes, S/D>40 cycles, and flame retardancy of V-0 as defined by UL-94 flaming test, and wherein S/D represents a number of dip cycles of the laminate in solder without thermal delamination, and in each of the dip cycles, the laminate is dipped at 288° C. for 10 seconds.