| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method capable of manufacturing a ceramic electronic component having high reliability. <P>SOLUTION: A method for manufacturing a ceramic electronic component includes the steps of: forming a first paste layer 25 on a first side surface 24c, and drying the first paste layer 25 while bringing the first paste layer 25 into contact with a swelling body 26 to allow the swelling body 26 to absorb a dispersion medium contained in the first paste layer 25 (first paste layer forming step); and forming a second paste layer on a second side surface 24d, and drying the second paste layer while bringing the second paste layer into contact with the swelling body 26 to allow the swelling body 26 to absorb a dispersion medium contained in the second paste layer (second paste layer forming step). <P>COPYRIGHT: (C)2013,JPO&INPIT |
