发明名称 Light emitting device package and light emitting device having lead-frames
摘要 The light emitting device package has a lengthwise direction as viewed from above and a lateral or widthwise direction perpendicular to the lengthwise direction, and is provided with two lead-frames lined-up in the lengthwise direction and molded resin formed as a single unit with the two lead-frames. The package is characterized in that each of the two lead-frames has a first thin region that is thinned by establishing a recess in the lower surface and/or the upper surface of the lead-frame, and that recess is covered with molded resin. Further, each lead-frame has an extension that narrows as it extends towards the opposite lead-frame. Both extensions are entirely within first thin regions, and as viewed from above, at least parts of the opposing extensions are positioned opposite each other in the lateral direction.
申请公布号 US9281460(B2) 申请公布日期 2016.03.08
申请号 US201314064200 申请日期 2013.10.28
申请人 NICHIA CORPORATION 发明人 Hayashi Hideki
分类号 H01L27/15;H01L29/267;H01L33/00;H01L31/0203;H01L23/48;H01L23/52;H01L33/62;H01L25/075 主分类号 H01L27/15
代理机构 Mori & Ward, LLP 代理人 Mori & Ward, LLP
主权项 1. A light emitting device having a lengthwise direction in a top view and a lateral or widthwise direction perpendicular to the lengthwise direction comprising: two lead-frames aligned in the lengthwise direction, at least one light emitting element mounted on an upper surface of at least one of the two lead lead-frames, and molded resin formed as a single unit with the two lead-frames, wherein each of the two lead-frames has a first thin region that forms a recess in the lower surface of each of the two lead-frames, and the recess is covered with the molded resin, and wherein each lead-frame has an extension that narrows as it extends towards the opposite lead-frame, each extension being entirely within first thin regions, and in a top view, at least parts of the opposing extension is positioned opposite each other in the lateral direction, and wherein a wire that connects the light emitting element mounted on one of the two lead-frames is connected with an upper surface of the extension of the opposite lead-frame.
地址 Anan-shi JP