发明名称 |
Light emitting device package and light emitting device having lead-frames |
摘要 |
The light emitting device package has a lengthwise direction as viewed from above and a lateral or widthwise direction perpendicular to the lengthwise direction, and is provided with two lead-frames lined-up in the lengthwise direction and molded resin formed as a single unit with the two lead-frames. The package is characterized in that each of the two lead-frames has a first thin region that is thinned by establishing a recess in the lower surface and/or the upper surface of the lead-frame, and that recess is covered with molded resin. Further, each lead-frame has an extension that narrows as it extends towards the opposite lead-frame. Both extensions are entirely within first thin regions, and as viewed from above, at least parts of the opposing extensions are positioned opposite each other in the lateral direction. |
申请公布号 |
US9281460(B2) |
申请公布日期 |
2016.03.08 |
申请号 |
US201314064200 |
申请日期 |
2013.10.28 |
申请人 |
NICHIA CORPORATION |
发明人 |
Hayashi Hideki |
分类号 |
H01L27/15;H01L29/267;H01L33/00;H01L31/0203;H01L23/48;H01L23/52;H01L33/62;H01L25/075 |
主分类号 |
H01L27/15 |
代理机构 |
Mori & Ward, LLP |
代理人 |
Mori & Ward, LLP |
主权项 |
1. A light emitting device having a lengthwise direction in a top view and a lateral or widthwise direction perpendicular to the lengthwise direction comprising:
two lead-frames aligned in the lengthwise direction, at least one light emitting element mounted on an upper surface of at least one of the two lead lead-frames, and molded resin formed as a single unit with the two lead-frames, wherein each of the two lead-frames has a first thin region that forms a recess in the lower surface of each of the two lead-frames, and the recess is covered with the molded resin, and wherein each lead-frame has an extension that narrows as it extends towards the opposite lead-frame, each extension being entirely within first thin regions, and in a top view, at least parts of the opposing extension is positioned opposite each other in the lateral direction, and wherein a wire that connects the light emitting element mounted on one of the two lead-frames is connected with an upper surface of the extension of the opposite lead-frame. |
地址 |
Anan-shi JP |