| 发明名称 |
Semiconductor package including a connecting member |
| 摘要 |
The semiconductor package according to an exemplary embodiment in the present disclosure includes: at least one electronic device; a lead frame including a plurality of leads electrically connected to the electronic device; a lead connecting member coupled to at least one of the leads; and a molded portion sealing the electronic device and the lead connecting member. |
| 申请公布号 |
US9281257(B2) |
申请公布日期 |
2016.03.08 |
| 申请号 |
US201414501577 |
申请日期 |
2014.09.30 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
Myung Jun Woo;Song Sung Min |
| 分类号 |
H01L23/31;H01L23/495;H01L23/00 |
主分类号 |
H01L23/31 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package comprising:
at least one electronic device; a lead frame including a plurality of leads electrically connected to the electronic device; a lead connecting member coupled to at least one of the leads; and a molded portion sealing the electronic device and the lead connecting member, wherein the leads include at least one through hole to which the lead connecting member is coupled. |
| 地址 |
Suwon KR |
