| 摘要 |
To facilitate the registered connection between a ball grid array package and an associated multi-tiered circuit board, a spaced series of vias are formed transversely through the board substrate between its opposite first and second sides. A spaced series of relatively shallow, circularly cross-sectioned socket areas, offset from the vias, are also formed on the first side of the circuit board. The sockets have diameters slightly larger that those of the generally ball-shaped leads of the BGA package, and are positioned on the same centerline pattern as the leads. After the vias and sockets are formed, a multi-layer metallic coating is deposited on their interiors and around their open ends on the first board side, with the coating being extended across the first board side between associated socket and via pairs. Using a high precision pick and place machine, the BGA package is placed against the first board side in a manner causing the BGA leads to partially enter the plated sockets, the sockets facilitating the registration between the BGA leads and the lead connection areas of the metallic coating. A resilient clamping structure is then used to releasably hold the BGA leads in their associated metal-coated sockets.
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