发明名称 DEVICE AND METHOD FOR MOLD TEMPERATURE ADJUSTMENT
摘要 PROBLEM TO BE SOLVED: To provide a device and a method for mold temperature adjustment which can reduce deposition of scale in a conduit line through which a cooling medium for cooling a temperature adjustment medium flows.SOLUTION: A mold temperature adjustment device 1 supplies a temperature adjustment medium to a medium passage 4 provided in a mold 3 in a circulating manner and includes a heat exchanger 30 which has a cooling path 32 always causing the cooling medium to flow through in a stationary operation state of the mold temperature adjustment device and a medium path 31 causing the temperature medium heat-exchanged indirectly by the cooling path to flow through and a control part 34 making the medium path to conduct a control of flowing the temperature adjustment medium in cooling the temperature adjustment medium.SELECTED DRAWING: Figure 1
申请公布号 JP2016030393(A) 申请公布日期 2016.03.07
申请号 JP20140153928 申请日期 2014.07.29
申请人 MATSUI MFG CO 发明人 METSUGI MASAAKI
分类号 B29C33/04;B29C45/73 主分类号 B29C33/04
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