| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of reducing the cost of manufacture.SOLUTION: A semiconductor device 1A includes: a substrate 100A that has a principal surface 101A, an outside surface 103A crossing to the principal surface 101A, and a recessed part 108A recessed from the principal surface 101A, and that is formed of a semiconductor material; a wiring layer 200A at least a part of which is formed on the substrate 100A; one or more elements 311A, 312A, and 313A housed in the recessed part 108A; and an encapsulation resin 400A that covers at least a part of the one or more elements 311A, 312A, and 313A. The outside surface 103A includes: a standing outside surface 105A; and an inclined outside surface 104A that is interposed between the principal surface 101A and the standing outside surface 105A, and that is inclined to both the principal surface 101A and the standing outside surface 105A.SELECTED DRAWING: Figure 3 |
