| 摘要 |
PROBLEM TO BE SOLVED: To provide a junction material capable of further improving reliability after junction in a case of using a specific junction material, and a semiconductor device joined to a counterpart using the junction material.SOLUTION: A plate-like junction material 10 comprises: a Zn-based metallic material layer 1 mainly containing Zn; an Al-based metallic material layer 2 provided on the Zn-based metallic material layer 1 and mainly containing Al; and an X-based metallic material layer (Cu-based metallic material layer 3) provided on the Al-based metallic material layer 2 and mainly containing Cu, Au, Ag or Sn, the Zn-based metallic material layer 1 containing therein a metallic plate (invar mesh 4) formed of a metallic material having a coefficient of thermal expansion of not higher than 5 and including a plurality of through-holes.SELECTED DRAWING: Figure 1 |
