| 摘要 |
The present invention relates to an adsorption fixing means of a semiconductor package which is installed to be connected to a reciprocal transfer unit for reciprocal transfer to adsorb and fix a printed circuit board (PCB) according to an operation of an adsorption device. The adsorption fixing means according to the present invention is characterized in comprising: a fixing plate; an elevation means which consists of a guider installed on the fixing plate and an elevation unit which is raised up and down according to an operation of an elevation cylinder; an adsorption unit which consists of an air suction connector, which is coupled with and fixed on the elevation unit of the elevation means and includes an air suction connecting hole connected to the adsorption device, an air suction connecting plate which forms an air suction passage communicating with the air suction connecting hole of the air suction connector and is coupled with and fixed on an upper portion of the air suction connector, and an air suction plate which includes a plurality of air suction holes, which are connected to the air suction passage of the air suction connecting plate to suck up the PCB and is installed to be fixed on an upper portion of the air suction connecting plate; and a rubber pad which is installed on the air suction plate formed in the adsorption unit and elasticity presses a lower surface of the PCB when the PCB is sucked up, so that the PCB is protected from being bent. According to the present invention, when the PCB is adsorbed by the adsorption unit, the rubber pad installed on an adsorption plate can support the PCB at a flat position by pressing the PCB. Therefore, even the PCB which is bent during an epoxy molding compound (EMC) molding process can be easily adsorbed and fixed, which facilitates vision inspection and marking processes. |
