发明名称 POLYAMIDE-BASED RESIN COMPOSITION FOR INJECTION FOAMING, AND INJECTION FOAM MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a polyamide-based resin composition for injection foaming capable of obtaining an injection foam molding having a high expansion ratio, uniform cells and excellent impact resistance with high formability.SOLUTION: A polyamide-based resin composition for injection foaming includes a polyamide resin (A) with a relative viscosity measured on conditions of 96% sulfuric acid as a solvent at a temperature of 25°C at a concentration of 1 g/100 ml being in a range of 2.0-4.0, and a polytetrafluoroethylene-containing resin (B). A content of the polytetrafluoroethylene-containing resin (B) with respect to 100 pts.wt. of the polyamide resin (A) is 0.05-3 pts.mass. A strain hardening coefficient measured at a temperature obtained by adding 10°C to the melting point of the resin composition is 1.05-10.SELECTED DRAWING: Figure 1
申请公布号 JP2016029141(A) 申请公布日期 2016.03.03
申请号 JP20150043623 申请日期 2015.03.05
申请人 UNITIKA LTD 发明人 NEGI YUKINARI;ISHII SHIGEAKI
分类号 C08L77/00;C08J9/06;C08K3/34;C08K3/36;C08K7/14;C08L23/08;C08L23/26;C08L27/18;C08L51/00 主分类号 C08L77/00
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