发明名称 BONDING CAPILLARY
摘要 PROBLEM TO BE SOLVED: To increase joint strength while suppressing the occurrence of cracks in a bonding wire, in a bonding capillary.SOLUTION: A bonding capillary according to an embodiment includes: a pressing surface pressing a bonding wire; an insertion hole through which the bonding wire is inserted; a tapered hole communicating the insertion hole with the pressing surface and expanding toward the pressing surface; and a chamfered portion provided between the tapered hole and the pressing surface. The chamfered portion has an irregular profile on a surface thereof, and the sharpness of projecting portions at the irregular profile is lower than that of recessed portions at the irregular profile.SELECTED DRAWING: Figure 7
申请公布号 JP2016029745(A) 申请公布日期 2016.03.03
申请号 JP20150233331 申请日期 2015.11.30
申请人 TOTO LTD 发明人 ONISHI JUMPEI;OKA SOICHIRO
分类号 H01L21/60 主分类号 H01L21/60
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