SEALING SHEET, SEALING SHEET WITH SEPARATOR, SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

摘要

In order to provide a sealing sheet capable of preventing same from falling off a suction collet during conveyancing, etc., and whereby semiconductor chips can be suitably buried, the sum α of a thickness t [mm] and a storage elastic modulus G' [Pa] at 50°C, for this sealing sheet, fulfils 300 ≤ α ≤ 1.5 × 105.