发明名称 |
METAL-CLAD LAMINATE AND METHOD FOR PRODUCING THE SAME, METAL FOIL WITH RESIN AND PRINTED WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a metal-clad laminate enabling a printed wiring board having further reduced loss upon signal transmission to be manufactured, and to provide a method for producing the metal-clad laminate.SOLUTION: The metal-clad laminate is provided that includes: an insulating layer 12 which contains a phenylene ether compound and is cured; a metal layer 13 joined to the insulating layer 12; and an intermediate layer 17 interposed between the insulating layer 12 and the metal layer 13 and containing a silane compound. The metal layer 13 has a joining surface 15 joined to the insulating layer 12 through the intermediate layer 17. A ten-point average roughness Rz of the joining surface 15 is 0.5 μm or more and 4 μm or less.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016028885(A) |
申请公布日期 |
2016.03.03 |
申请号 |
JP20150137785 |
申请日期 |
2015.07.09 |
申请人 |
PANASONIC IP MANAGEMENT CORP |
发明人 |
KITAI YUKI;FUJIWARA HIROAKI |
分类号 |
B32B15/08;C08F290/06;H05K1/03;H05K1/09 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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