发明名称 |
Component Protection Structures for Electronic Devices |
摘要 |
An electronic device may have a printed circuit to which electrical components are mounted. The electrical components may include a thermal sensor and a pressure sensor. A through hole in the printed circuit may receive the shaft of a standoff The standoff may be soldered to plated metal on the sides of the through hole. A screw or other fastener may secure the printed circuit to a housing for the electronic device. A ring-shaped metal member may be soldered to the printed circuit. The ring-shaped metal member may form a bumper that surrounds the screw or other fastener and the thermal sensor. The pressure sensor may have a port through which ambient pressure measurements are made. A dust protection cover such as a fabric or other porous layer may cover the port. |
申请公布号 |
US2016066438(A1) |
申请公布日期 |
2016.03.03 |
申请号 |
US201514801686 |
申请日期 |
2015.07.16 |
申请人 |
Apple Inc. |
发明人 |
Malek Shayan;Pakula David A.;Stephens Gregory N.;Cohen Sawyer I.;Myers Scott A.;Cater Tyler B.;Bates Eric W. |
分类号 |
H05K5/00;H05K1/18;H05K1/11 |
主分类号 |
H05K5/00 |
代理机构 |
|
代理人 |
|
主权项 |
1. Apparatus, comprising:
a printed circuit; a sensor mounted to the printed circuit: a fastener that secures the printed circuit to a support structure; and a ring-shaped bumper that surrounds the sensor and the fastener. |
地址 |
Cupertino CA US |