发明名称 Component Protection Structures for Electronic Devices
摘要 An electronic device may have a printed circuit to which electrical components are mounted. The electrical components may include a thermal sensor and a pressure sensor. A through hole in the printed circuit may receive the shaft of a standoff The standoff may be soldered to plated metal on the sides of the through hole. A screw or other fastener may secure the printed circuit to a housing for the electronic device. A ring-shaped metal member may be soldered to the printed circuit. The ring-shaped metal member may form a bumper that surrounds the screw or other fastener and the thermal sensor. The pressure sensor may have a port through which ambient pressure measurements are made. A dust protection cover such as a fabric or other porous layer may cover the port.
申请公布号 US2016066438(A1) 申请公布日期 2016.03.03
申请号 US201514801686 申请日期 2015.07.16
申请人 Apple Inc. 发明人 Malek Shayan;Pakula David A.;Stephens Gregory N.;Cohen Sawyer I.;Myers Scott A.;Cater Tyler B.;Bates Eric W.
分类号 H05K5/00;H05K1/18;H05K1/11 主分类号 H05K5/00
代理机构 代理人
主权项 1. Apparatus, comprising: a printed circuit; a sensor mounted to the printed circuit: a fastener that secures the printed circuit to a support structure; and a ring-shaped bumper that surrounds the sensor and the fastener.
地址 Cupertino CA US