发明名称 LIGHT EMITTING DEVICE PACKAGE
摘要 Provided is a light emitting diode package comprising: a package body; a first and a second lead frame disposed on the package body; and light emitting diodes connected electrically to each of the first and second lead frames through conductive adhesives, wherein at least one among the conductive adhesives has a smallest central portion width.
申请公布号 KR20160023328(A) 申请公布日期 2016.03.03
申请号 KR20140109575 申请日期 2014.08.22
申请人 LG INNOTEK CO., LTD. 发明人 OH, SUNG JOO;MOON, KEAL DOO
分类号 H01L33/62 主分类号 H01L33/62
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