发明名称 |
LIGHT EMITTING DEVICE PACKAGE |
摘要 |
Provided is a light emitting diode package comprising: a package body; a first and a second lead frame disposed on the package body; and light emitting diodes connected electrically to each of the first and second lead frames through conductive adhesives, wherein at least one among the conductive adhesives has a smallest central portion width. |
申请公布号 |
KR20160023328(A) |
申请公布日期 |
2016.03.03 |
申请号 |
KR20140109575 |
申请日期 |
2014.08.22 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
OH, SUNG JOO;MOON, KEAL DOO |
分类号 |
H01L33/62 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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