COOLING ARRANGEMENT FOR A CIRCUIT PACK

摘要

A circuit structure comprises a circuit board. An array of opto-electronic devices is provided on the circuit board. At least some of heat sinks are provided in thermal contact with a respective opto-electronic device. A face plate of the circuit structure comprises an array of openings configured to allow air to move along a path adjacent to an opto-electronic device and through a respective heat sink. An air moving device is located adjacent a heat sink and is operable to drive air through a respective opening on the face plate. A ducting structure is provided to direct the air driven by a corresponding air moving device.

主权项

1. A circuit structure comprising:
a circuit board; an array of opto-electronic devices; an array of heat sinks, at least some of the heat sinks from the array of heat sinks being in thermal contact with a respective opto-electronic device; and a face plate configured to allow optical connection from an external device to one or more opto-electronic devices;wherein the circuit structure further comprises:
one or more openings, located on the face plate wherein at least one opening is configured to allow air to move along a path adjacent to an opto-electronic device and through a respective heat sink; an air moving device located adjacent a heat sink configured to drive air through a respective opening; a ducting structure configured to direct the air driven by an air moving device.