发明名称 |
Embedded Dielectric As A Barrier In An Acoustic Device And Method Of Manufacture |
摘要 |
A base assembly for an acoustic transducer includes a first substrate with an acoustic port and a dielectric layer having a substantially uniform initial density. One surface of the dielectric layer contacts the first substrate. An opposite surface of the dielectric layer contacts a second substrate having an acoustic port. The respective acoustic ports of the first and second substrates are aligned with each other. The first substrate, the dielectric layer, and the second substrate are laminated together. A substantial portion of the dielectric layer laminated to the first and second substrates has a higher final density due to compaction than does a portion of the dielectric layer disposed in the respective acoustic ports of the first and second substrates. |
申请公布号 |
US2016066095(A1) |
申请公布日期 |
2016.03.03 |
申请号 |
US201514936109 |
申请日期 |
2015.11.09 |
申请人 |
Knowles Electronics, LLC |
发明人 |
Szczech John B.;Van Kessel Peter |
分类号 |
H04R7/10;H04R19/04 |
主分类号 |
H04R7/10 |
代理机构 |
|
代理人 |
|
主权项 |
1. A base assembly for an acoustic transducer, the base comprising:
a first substrate with an acoustic port; a dielectric layer having a substantially uniform initial density, wherein one surface of the dielectric layer contacts the first substrate; and a second substrate with an acoustic port, wherein an opposite surface of the dielectric layer contacts the second substrate; wherein the respective acoustic ports of the first and second substrates are aligned with each other, and the first substrate, the dielectric layer, and the second substrate are laminated together, wherein a substantial portion of the dielectric layer laminated to the first and second substrates has a higher final density due to compaction than does a portion of the dielectric layer disposed in the respective acoustic ports of the first and second substrates. |
地址 |
Itasca IL US |