发明名称 |
SEMICONDUCTOR STRUCTURE AND RECESS FORMATION ETCH TECHNIQUE |
摘要 |
A semiconductor structure has a first layer that includes a first semiconductor material and a second layer that includes a second semiconductor material. The first semiconductor material is selectively etchable over the second semiconductor material using a first etching process. The first layer is disposed over the second layer. A recess is disposed at least in the first layer. Also described is a method of forming a semiconductor structure that includes a recess. The method includes etching a region in a first layer using a first etching process. The first layer includes a first semiconductor material. The first etching process stops at a second layer beneath the first layer. The second layer includes a second semiconductor material. |
申请公布号 |
US2016064539(A1) |
申请公布日期 |
2016.03.03 |
申请号 |
US201314442546 |
申请日期 |
2013.11.15 |
申请人 |
Lu Bin;Sun Min;Palacios Tomas |
发明人 |
Lu Bin;Sun Min;Palacios Tomas |
分类号 |
H01L29/778;H01L29/205;H01L29/417;H01L29/66;H01L21/306;H01L29/20;H01L29/423 |
主分类号 |
H01L29/778 |
代理机构 |
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代理人 |
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主权项 |
1. A transistor, comprising:
a channel layer; and a barrier layer comprising a first layer including first semiconductor material and a second layer including a second semiconductor material, wherein the first layer is disposed over the second layer, wherein the first semiconductor material is selectively etchable over the second semiconductor material using a dry etching process, and wherein a gate recess is disposed at least in the first layer; and a gate disposed in the gate recess. |
地址 |
Boston MA US |