发明名称 SEMICONDUCTOR STRUCTURE AND RECESS FORMATION ETCH TECHNIQUE
摘要 A semiconductor structure has a first layer that includes a first semiconductor material and a second layer that includes a second semiconductor material. The first semiconductor material is selectively etchable over the second semiconductor material using a first etching process. The first layer is disposed over the second layer. A recess is disposed at least in the first layer. Also described is a method of forming a semiconductor structure that includes a recess. The method includes etching a region in a first layer using a first etching process. The first layer includes a first semiconductor material. The first etching process stops at a second layer beneath the first layer. The second layer includes a second semiconductor material.
申请公布号 US2016064539(A1) 申请公布日期 2016.03.03
申请号 US201314442546 申请日期 2013.11.15
申请人 Lu Bin;Sun Min;Palacios Tomas 发明人 Lu Bin;Sun Min;Palacios Tomas
分类号 H01L29/778;H01L29/205;H01L29/417;H01L29/66;H01L21/306;H01L29/20;H01L29/423 主分类号 H01L29/778
代理机构 代理人
主权项 1. A transistor, comprising: a channel layer; and a barrier layer comprising a first layer including first semiconductor material and a second layer including a second semiconductor material, wherein the first layer is disposed over the second layer, wherein the first semiconductor material is selectively etchable over the second semiconductor material using a dry etching process, and wherein a gate recess is disposed at least in the first layer; and a gate disposed in the gate recess.
地址 Boston MA US