CHIP PACKAGES AND METHODS OF MANUFACTURE THEREOF

摘要

Chip packages and methods of manufacture thereof are described. In an embodiment, a method for manufacturing a chip package may include: providing a support structure including: a base; and a stage pivotably attached to the base, the stage having a surface facing away from the base; attaching a first die having at least one second die disposed thereon to the surface of the stage; pivotably tilting the stage; and after the pivotably tilting, dispensing an underfill over the first die and adjacent to the least one second die, the underfill flowing through a first standoff gap disposed between the first die and the at least one second die.

主权项

1. A method comprising:
providing a support structure having a chip stack attached to an inclined surface of the support structure, the chip stack comprising:
a first die;at least one second die disposed over the first die; anda first standoff gap between the first die and the at least one second die, wherein the at least one second die has a first sidewall and a second sidewall opposite the first sidewall, the first sidewall disposed higher on the inclined surface of the support structure than the second sidewall; and dispensing an underfill over the first die and adjacent to the first sidewall of the at least one second die, the underfill flowing through the first standoff gap from the first sidewall to the second sidewall of the at least one second die.