| 发明名称 |
PART-EMBEDDED CIRCUIT STRUCTURE AND METHOD FOR MANUFACTURING SAME |
| 摘要 |
A method for manufacturing a part-embedded circuit structure includes: forming an inner resist layer with an opening on a base member to expose a portion of the base member; forming an inner wiring layer on the inner resist layer which extends into the opening of the inner resist layer; laminating a dielectric layer on the inner wiring layer; forming an outer wiring layer on the dielectric layer opposite to the inner wiring layer; and removing the base member to expose the inner wiring layer in the opening and the inner resist layer such that a level plane is formed. |
| 申请公布号 |
US2016066418(A1) |
申请公布日期 |
2016.03.03 |
| 申请号 |
US201514841720 |
申请日期 |
2015.09.01 |
| 申请人 |
HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. ;FuKui Precision Component (Shenzhen) Co., Ltd. ;Zhen Ding Technology Co., Ltd. |
发明人 |
CHENG YU-HAO;WANG YUE;HU WEN-HUNG |
| 分类号 |
H05K1/02;H05K3/46;H05K3/42;H05K1/11 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing a part-embedded circuit structure comprising:
forming an inner resist layer with an opening on a base member to expose a portion of the base member; forming an inner wiring layer on the inner resist layer which extends into the opening of the inner resist layer; laminating a dielectric layer on the inner wiring layer; forming an outer wiring layer on the dielectric layer opposite to the inner wiring layer; and removing the base member to expose the inner wiring layer in the opening and the inner resist layer such that a level plane is formed. |
| 地址 |
Qinhuangdao CN |
