| 发明名称 |
DRY FILM AND PRINTED WIRING BOARD |
| 摘要 |
An object of the present invention is to provide: a dry film comprising a resin layer which has excellent detachability from a carrier film and in which cracking and powdering are inhibited; and a printed wiring board comprising a cured article obtained by curing the dry film. The dry film comprises a resin layer containing a thermosetting resin component, a filler and at least two solvents, wherein the at least two solvents both have a boiling point of 100° C. or higher and the boiling points of the at least two solvents are different by not less than 5° C. |
| 申请公布号 |
US2016060408(A1) |
申请公布日期 |
2016.03.03 |
| 申请号 |
US201514934700 |
申请日期 |
2015.11.06 |
| 申请人 |
TAIYO INK MFG. CO., LTD. |
发明人 |
CHUJO Takayuki;ENDO Arata |
| 分类号 |
C08J5/18;H05K1/02;H05K1/03 |
主分类号 |
C08J5/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A dry film, comprising:
a resin layer containing a thermosetting resin component, a filler and at least two solvents, wherein the at least two solvents both have a boiling point of 100° C. or higher and the boiling points of the at least two solvents are different by not less than 5° C. |
| 地址 |
Hiki-gun JP |
