COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING

摘要

PROBLEM TO BE SOLVED: To provide suppressing agents capable of providing a substantially voidless and seamless filling of features on the nanometer scale and on the micrometer scale with a copper electroplating bath.SOLUTION: A composition for metal plating comprises at least one kind of metal ions and at least one additive. The additive is obtained by reacting a polyhydric alcohol comprising at least 5 hydroxyl functional groups with a third alkylene oxide, a second alkylene oxide and a first alkylene oxide in this order. The third alkylene oxide has a longer alkyl chain than the second alkylene oxide, and the second alkylene oxide has a longer alkyl chain than the first alkylene oxide.SELECTED DRAWING: None